By James J. Licari

  • "I suggest this publication with no reservation to everybody in electronics who needs to comprehend adhesives, or make judgements approximately adhesives, or both." - George Riley

Content:
Preface

, Pages vii-viii
Acknowledgements

, Pages ix-x
1 - Introduction

, Pages 1-37
2 - capabilities and conception of Adhesives

, Pages 39-94
3 - Chemistry, formula, and homes of Adhesives

, Pages 95-168
4 - Adhesive Bonding Processes

, Pages 169-260
5 - Applications

, Pages 261-346
6 - Reliability

, Pages 347-391
7 - try and Inspection Methods

, Pages 393-430
Appendix

, Pages 431-439
Index

, Pages 441-457

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Extra info for Adhesives Technology for Electronic Applications. Materials, Processes, Reliability

Example text

17] • � Residues from electroplating baths also enhance bleedout. 2 Rheology The rheology, or flow properties, of adhesives is important not only to achieve adequate coverage and wetting, but also to develop the process parameters necessary to dispense the adhesive (see Ch. 4). Flow properties are determined by measuring viscosity and thixotropy. Viscosity, η, is a measure of the internal friction of a material and its resistance to flow. [18] Eq. 5) η = Shear stress ÷ Shear rate The viscosity of liquid adhesives decreases with increasing temperature until polymerization begins to occur, then increases.

As a rule, the gap height should be twice the size of the filler particles. [23][29] In practice, even for highly filled formulations, the viscosity can be lowered during the dispensing operation by heating the material or the substrate. [23][33] Besides viscosity, the surface-wetting ability of underfills is critical to capillary flow. 6. Capillary-flow diagram showing the velocity of an advancing front of underfill material as it flows between the two surfaces. ) 52 ADHESIVES TECHNOLOGY FOR ELECTRONIC APPLICATIONS the surfaces being bonded.

The particle sizes of fillers also affect the ability to underfill parts effectively. As a rule, the gap height should be twice the size of the filler particles. [23][29] In practice, even for highly filled formulations, the viscosity can be lowered during the dispensing operation by heating the material or the substrate. [23][33] Besides viscosity, the surface-wetting ability of underfills is critical to capillary flow. 6. Capillary-flow diagram showing the velocity of an advancing front of underfill material as it flows between the two surfaces.

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